The IPC-1602 standard provides requirements intended to protect printed boards from contamination, physical damage, solderability degradation and moisture uptake. Consideration is given to packaging materials types and methods, production environment, handling and transport of product, and establishing baking profiles for moisture removal. IPC-1602 is now providing requirements that can be called out within procurement documentation. The IPC-1602 standard provides expanded coverage of moisture barrier bags (MBBs), the impact of baking on printed board solderability, ESD issues, moisture concerns for etched cores and composites, desiccant material and HIC cards, and example of flow downs of packaging and handling requirements.
Single-Device DRM-Protected Document
This document has single-device/user digital rights management (DRM) protection. This document will only be accessible by a single user on a single device. If you are purchasing this DRM-protected document for another user, you will need to provide contact information for that user when placing your order.
For information about IPC standards with DRM protection, visit www.ipc.org/drm.