IPC-2222A: Sectional Design Standard for Rigid Organic Printed Boards


This standard establishes the specific requirements for the design of rigid organic printed boards.

Purpose The requirements contained herein are intended to establish specific design details that shall be used in conjunction with IPC-2221 to produce designs intended to mount and attach components. The components may be through-hole, surface mount, fine pitch, ultra-fine pitch, array mounting or unpackaged bare die.The organic materials may be homogeneous, reinforced, or used in combination with inorganic materials; the interconnections may be single, double, or multilayered. They may be any combination able to perform the physical, thermal, environmental, and electronic function.

Document Hierarchy Document hierarchy shall be in accordance with the generic standard IPC-2221.
Presentation Presentation shall be in accordance with the generic standard IPC-2221.
Interpretation Interpretation shall be in accordance with the generic standard IPC-2221.
Definition of Terms The definition of all terms used herein shall be in accordance with IPC-T-50 and as defined in 1.5.1.

As Agreed Between User and Supplier (AABUS) Indicates additional or alternate requirements to be decided between the user and the supplier in the procurement documentation. Examples include contractual requirements, modifications to purchase documentation and information on the drawing. Agreements can be used to define test methods, conditions, frequencies, categories or acceptance criteria within a test, if not already established.

Classification of Products Classification of products shall be in accordance with the generic standard IPC-2221 and as defined in 1.6.1.

Printed Board Type
This standard provides design information for different printed board types. Printed board types are classified as:

Type 1 — Single-Sided Printed Board
Type 2 — Double-Sided Printed Board
Type 3 — Multilayer Board without Blind or Buried Vias
Type 4 — Multilayer Board with Blind and/or Buried Vias
Type 5 — Multilayer Metal-Core Board without Blind or Buried Vias
Type 6 — Multilayer Metal-Core Board with Blind and/or Buried Vias

Applicability The contents of this standard may not apply to certain leading edge technologies. Refer to IPC-2221 for additional information.

Revision Level Changes Changes that were incorporated in the current revision of this specification are indicated throughout by gray shading of the relevant subsection(s). Changes to a figure or table are indicated by gray shading of the Figure or Table header.



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Used in conjunction with IPC-2221, IPC-2222 establishes the specific requirements for the design of rigid organic printed boards and other forms of component mounting and interconnecting structures. This standard applies to single-sided, double-sided or multi-layered boards. Key concepts in this document are: rigid laminate properties, design requirements for printed board assembly and design requirements for holes/interconnections. Revision A provides new design guidance and requirements for dielectric spacing, lead-free laminate materials, scoring and routing parameters, printed board thickness tolerance, nonfunctional lands, hole aspect ratios and clearance areas in planes.